EMVA welcomes Eleven Dynamics

Eleven Dynamics combines industrial AI, automation, machine vision, and measurement technology into a single control layer for autonomous manufacturing. Our open platform EDAS connects robots, AI-powered cameras, sensors, and metrology systems to enable flexible Inline and Atline inspection with reliable results and tight cycle times

Delta Optical Thin Film becomes EMVA member

Delta Optical Thin Film A/S is a privately owned manufacturer of advanced optical thin film components. We focus entirely on designing and manufacturing custom parts for our global OEM customers. Being one of the pioneers in the optical thin film coating industry, we use our extensive knowledge to interact with our customers and find the right solution for their volume applications at the right price. Our unique products are Continuously Variable Filters. They are used to build compact, robust and affordable multispectral or hyperspectral cameras. Classical filters for machine vision cover the wavelength range from 300 nm to 1700 nm.

Vanessa Staderini receives EMVA Young Professional Award 2026

Awarded work focusses on Integrated Planning and Optimization for Robotic Visual Inspection

Barcelona/Stockholm, June 23rd, 2026. The EMVA Young Professional Award 2026 goes to Vanessa Staderini for her research work titled Integrated Planning and Optimization Framework for Robotic Visual Inspection. Vanessa Staderini received her Ph.D. in Electrical Engineering from TU Wien, where her research focused on bridging robotics and computer vision for automated visual inspection and inspection planning in industrial environments. Her doctoral work has been recognized with multiple Best Paper Awards at international conferences. She holds an M.Sc. in Robotics and Automation Engineering and a B.Sc. in Biomedical Engineering from the University of Pisa. She is currently a Scientist at the Austrian Institute of Technology in Vienna, where her work focuses on industrial inspection planning and robotic solutions for manufacturing applications.

Awarded work: Integrated Planning and Optimization for Robotic Visual Inspection
The work bridges the gap between advances in computer vision and robotics and the practical needs of industrial inspection. It integrates rigorous optimization and vision modeling into a planning framework designed for real robotic systems. Staderini proposes a model-based approach in which geometric coverage, spatial resolution, photometric feasibility, robotic kinematics, and motion are optimized jointly. Starting from CAD data, inspection poses are generated by sampling the object surface and refined via Bayesian optimization to ensure coverage and kinematic feasibility. Viewpoint selection and path planning are then formulated jointly as a Set Coverage Generalized Traveling Salesman Problem, which is solved using integer linear programming. This determines the minimal set of inspection viewpoints together with their optimal collision-free visiting order, providing a globally optimal and executable inspection plan without relying on heuristics. Beyond visibility, defect detection requires guaranteed spatial resolution. Staderini introduces sampling density matrix that extends binary visibility by enforcing minimum resolution constraints per surface element, enabling different regions of a component to be inspected at different resolution levels. In this way, inspection requirements such as defect detectability become explicit optimization objectives. To address reflective materials, photometric modeling is integrated into viewpoint evaluation.

Left to right:
Chris Yates (EMVA President), Vanessa Staderini, Marco Diani (EMVA Board Member)


About EMVA

Founded in 2003, the European Machine Vision Association (EMVA) is a not-for-profit and non-commercial association representing the Machine Vision industry in Europe that is open for all types of organizations having a stake in machine vision, computer vision, embedded vision or imaging technologies: manufacturers, system and machine builders, integrators, distributors, consultancies, research organizations and academia. The EMVA hosts four international vision standards, and all members – as the 100% owners of the association – benefit from the dedicated networking, standardization, and cooperation activities of the EMVA. www.emva.org

Wrap-Up IVSM Spring Meeting Prague

Main outcomes and decisions from the standard working groups

The machine vision standardization community is looking back on a successful spring edition of the International Vision Standards Meeting (IVSM) which was hosted by the European Machine Vision Association (EMVA) and held in the Czech capital, Prague from April 13 – 17. Overall, 82 machine vision engineers from all over the world have attended the meeting in person. The main discussions and decisions in the working groups are summarized as follows. Above that, a common theme in many meetings was the possible impacts of the EU Cyber Resilience Act and how to address the topic.

The GenICam meeting was attended by over 50 engineers. After more than three years of development, the working group released new versions of the Standard Features Naming Convention (SFNC) and the GenDC standard. SFNC 2.8 and GenDC 1.2 can now be downloaded from the EMVA website. Also discussed were major future extensions under development like the Generic Feature Access API (working title GenFeA), optimization potentials of the GenApi reference implementation, and future SFNC extensions including EMVA 1288 extensions for enhanced/automated data capturing during testing and support for hyperspectral cameras, upcoming updates to the GenApi reference implementation as well as the GenICam Device Validation, which aims to enhance interoperability in the Machine Vision marketplace between devices and software applications.

The CameraLinkHS working group plans to release the standard version 1.3 by the end of the year. It will contain some clarification of how to use MPO to LC fiber break-out-cable, add the defined way to transmit 32 bits per pixel and will include other minor improvements.

The USB3 Vision® technical meeting took place on Friday, April 17. Engineers from the standard working group discussed future possible extensions to the standard. The discussion on testing devices without High-Speed USB resulted in input for updating compliance documentation. An update was given on Infineon electronic parts. Overall, the meeting was productive and defined several follow-up actions for the technical community.

The GigEVision meeting included final changes on the GigEVision v. 3.0 which was set to be tested at the plugfest (see below). In connection to that, the voting for the release candidate of GigEVision 3.0 was prepared.

During the OOCI working group meeting a presentation was held by JIIA addressing their local standard LensConnect, which is about to be released by the end of 2026 being complimentary to OOCI. JIIA intends to use the OOCI-SFNC integration to enable easy software integration of the standard by end-users. In addition, farewell was given to the Chairs Marcel Naggatz and Erik Widding, connected with a call for new chairs.

The CoaXPress meeting addressed final changes on the CoaXPress 3.0 specification for the plugfest, and a release plan for the standard version to be agreed with the hosting association JIIA. Another topic was an update and roadmap about MicroChip 25Gbps components.

JIIA held a session at the IVSM to introduce two new standardization activities. One is the latest JIIA standard, LensConnect. The other is Small Optical Connectors.

Always being one of the highlights, the traditional plugfest gathered engineers applying the standards connecting a wide range of products to test compatibility, functionality and technical performance. Herein, the release candidate of GigEVision 3.0 had its inaugurating plugfest in preparing the release of the standard version.

During the commonly held Future Standards Forum (FSF) it was agreed that the G3 information brochure presenting machine vision standards will get a feature update regarding CoaXPress 2.x, CoaXPress-over-fiber and GigE Vision 3.0 to be ready in June and a major layout-change later in 2026.

Finally, the timeline for the two next International Vision Standard Meetings were announced:

  • Autumn 2026 IVSM hosted by A3 in Ottawa/Canada, October 2026
  • Spring 2027 IVSM hosted by JIIA in Fukuoka/Japan, April 2027.

The IVSM format is supported by the G3 group formed by A3 (US), CMVU (China), JIIA (Japan), EMVA (Europe) and VDMA (Germany).

GenICam Working Group Updates

During the International Vision Standard Meeting in Prague in April which was hosted by the EMVA, the GenICam working group has released two module updates with the following details:
Module – Standard Features Naming Convention (SFNC) version 2.8:

1. New Features and Component Additions
  • Added CoordinateMapA and CoordinateMapB component types.
  • Added A and B coordinate map support for Scan 3D Projection output mode.
  • Added Scan 3D Projection output mode.
  • Added Scan3dCoordinateMapEnable for enhanced 3D scanning workflows.
  • Added JPEG XS support as a new compression/encoding option.
  • Added UserSetReset feature.
2. Units and Standards Improvements
  • Updated electrical units: Volt → V, Amp → A.
  • Added these updated units to the Standard Units table.
  • Added missing ns (nanoseconds) unit to the standards list.
  • Set ns as the unit for all timestamp related features for consistency.
3. Clarifications and Requirements
  • Added notes outlining requirements for Trigger, Exposure, and Gain features.
  • Clarified usage and units for EncoderResolution and DeviceLinkSpeed.
  • Clarified GroupSelector Interface type behavior when very large numbers of groups are present.
  • Made all Device SFNC version features mandatory to ensure consistent versioning.
4. GigE Vision and CoaXPress Updates
  • Added GevStreamingMode and GevControlChannelMaxPacketSize for improved GigE Vision configuration for the upcoming GigE Vision 3.0 specification.
  • Removed explicit CXP link speed reference and added clarifications around test mode behavior.
5. General Corrections
  • Miscellaneous minor corrections, text clarifications, and precision improvements throughout the document.

Module – GenDC version 1.2:

  • Introduced support for JPEG-XS payloads
  • Miscellaneous clarifications have been added to ensure better interoperability

Young Professional Award ’26 | Last Chance to Apply

The deadline to apply for the EMVA Young Professional Award has been extended to April 30, 2026

The annual award is endowed with 1500 Euros to honor the outstanding and innovative work of a student or a young professional in the field of machine vision or image processing.

It is the goal of the European Machine Vision Association EMVA to support further innovation in our industry, to contribute to the important aspect of dedicated machine vision education, and to provide a bridge between research and industry.

 


The winner of the award will be announced at the flagship 24. EMVA Business Conference 2026 taking place June 18-20, 2026 in Stockholm, Sweden, and will have the opportunity to present the awarded work to the machine vision industry leaders from Europe and abroad. The presentation will then be published by the international machine vision press.
In addition to the honor of the EMVA Young Professional Award endowed with 1500 Euros and the publicity for the research work is a free conference pass for the EMVA Business Conference as well as the coverage of all travel cost to Stockholm and a free pass for the 2026 European Machine Vision Forum.

 



The Power of Machine Vision in Packaging: First Podcast by EMVA

This podcast is presented by EMVA in collaboration with Packaging Europe.

The episode explores how machine vision technologies are driving digital transformation across the industry ahead of interpack 2026.
The podcast highlights practical applications, current developments, and strategic perspectives on the use of machine vision in packaging environments. Topics addressed include the impact of machine vision on quality control and error reduction, efficiency gains through automation and vision technologies, as well as key trends shaping packaging processes in the coming years.
Featured speakers include:

  • Rick de Vries, Advantech
  • Torsten Wiesinger, LUCID Vision Labs
  • Simon Knapp, Murrelektronik

The discussion provides practical insights into how machine vision technologies can be implemented in real-world production environments and how they contribute to more efficient and flexible packaging processes.

Read the Article and Listen the Podcast

EMVA welcomes new member UBICEPT

Ubicept enables the adoption of SPAD imaging systems by delivering the processing required to make them practical at scale. Advances from major sensor manufacturers are rapidly improving the performance and economics of SPAD sensors, yet their output consists of large volumes of photon data that traditional imaging approaches cannot handle. Ubicept efficiently converts this data into high-quality video and perception outputs, enabling reliable operation in lighting and motion conditions beyond what conventional CMOS cameras can handle. Our technology integrates into real-world systems, from embedded platforms to production imaging pipelines.

EMVA Panel Discussion at LogiMAT Expert Forum 

On the Way to the Dark Warehouse – Creating Value with Machine Vision in Logistics is a panel discussion organized by EMVA on Tuesday, 24 March on the Expert Forum stage of LogiMAT at Messe Stuttgart.

The discussion from 14:10 – 15:00 h will highlight practical use cases, scaling experience and strategic perspectives on the path towards more automated logistics environments. Topics to be addressed include current business impacts and practical implementation experience of machine vision technology in logistics; chances and obstacles of scaling machine vision implementation across warehouses; deployment approaches and strategic priorities; as well as the evolution of warehouse automation in the coming years including the role of AI.

Panelists are:

  • Nicholas Tengelin, Chief Executive Officer, Rebl Industries
  • Phil Sambrook, Transport and Logistics Vertical Strategy Lead EMEA, Zebra Technologies
  • Volker Glöckle, Senior Vice President, Integrated Automation, SICK AG
  • Jonathan Kesteloot, Co-founder, CAPTIC.

The forum is moderated by Prof. Dr.-Ing. Jana Jost, Head of the Institute of Logistics Engineering (TUHH) and Principal Investigator at the Robotics Institute Germany (Fraunhofer IML).


The EMVA Member Booth at LogiMAT 2026 is located in hall 2, 2C14.