Main outcomes and decisions from the standard working groups

The machine vision standardization community is looking back on a successful spring edition of the International Vision Standards Meeting (IVSM) which was hosted by the European Machine Vision Association (EMVA) and held in the Czech capital, Prague from April 13 – 17. Overall, 82 machine vision engineers from all over the world have attended the meeting in person. The main discussions and decisions in the working groups are summarized as follows. Above that, a common theme in many meetings was the possible impacts of the EU Cyber Resilience Act and how to address the topic.

The GenICam meeting was attended by over 50 engineers. After more than three years of development, the working group released new versions of the Standard Features Naming Convention (SFNC) and the GenDC standard. SFNC 2.8 and GenDC 1.2 can now be downloaded from the EMVA website. Also discussed were major future extensions under development like the Generic Feature Access API (working title GenFeA), optimization potentials of the GenApi reference implementation, and future SFNC extensions including EMVA 1288 extensions for enhanced/automated data capturing during testing and support for hyperspectral cameras, upcoming updates to the GenApi reference implementation as well as the GenICam Device Validation, which aims to enhance interoperability in the Machine Vision marketplace between devices and software applications.

The CameraLinkHS working group plans to release the standard version 1.3 by the end of the year. It will contain some clarification of how to use MPO to LC fiber break-out-cable, add the defined way to transmit 32 bits per pixel and will include other minor improvements.

The USB3 Vision® technical meeting took place on Friday, April 17. Engineers from the standard working group discussed future possible extensions to the standard. The discussion on testing devices without High-Speed USB resulted in input for updating compliance documentation. An update was given on Infineon electronic parts. Overall, the meeting was productive and defined several follow-up actions for the technical community.

The GigEVision meeting included final changes on the GigEVision v. 3.0 which was set to be tested at the plugfest (see below). In connection to that, the voting for the release candidate of GigEVision 3.0 was prepared.

During the OOCI working group meeting a presentation was held by JIIA addressing their local standard LensConnect, which is about to be released by the end of 2026 being complimentary to OOCI. JIIA intends to use the OOCI-SFNC integration to enable easy software integration of the standard by end-users. In addition, farewell was given to the Chairs Marcel Naggatz and Erik Widding, connected with a call for new chairs.

The CoaXPress meeting addressed final changes on the CoaXPress 3.0 specification for the plugfest, and a release plan for the standard version to be agreed with the hosting association JIIA. Another topic was an update and roadmap about MicroChip 25Gbps components.

JIIA held a session at the IVSM to introduce two new standardization activities. One is the latest JIIA standard, LensConnect. The other is Small Optical Connectors.

Always being one of the highlights, the traditional plugfest gathered engineers applying the standards connecting a wide range of products to test compatibility, functionality and technical performance. Herein, the release candidate of GigEVision 3.0 had its inaugurating plugfest in preparing the release of the standard version.

During the commonly held Future Standards Forum (FSF) it was agreed that the G3 information brochure presenting machine vision standards will get a feature update regarding CoaXPress 2.x, CoaXPress-over-fiber and GigE Vision 3.0 to be ready in June and a major layout-change later in 2026.

Finally, the timeline for the two next International Vision Standard Meetings were announced:

• Autumn 2026 IVSM hosted by A3 in Ottawa/Canada, October 2026
• Spring 2027 IVSM hosted by JIIA in Fukuoka/Japan, April 2027.

The IVSM format is supported by the G3 group formed by A3 (US), CMVU (China), JIIA (Japan), EMVA (Europe) and VDMA (Germany).

Barcelona, January 28^th, 2026. The European Machine Vision Association (EMVA) will once again be providing detailed information on the key technology of machine vision in two exhibition areas at LogiMAT 2026. From AI-supported product identification and autonomous conveyor platforms to fully automated dark warehouses, cameras have become indispensable in logistics for modernizing processes and increasing efficiency. Experience it live from March 24 to 26 at Messe Stuttgart:

EMVA Member Booth

In Hall 2, EMVA member companies will showcase their solution expertise for machine vision applications in intralogistics at the joint booth. This year’s participants include ADVANTECH Europe B.V., IDS Imaging Development Systems GmbH, iiM GmbH, Murrelektronik GmbH, Neousys Technology Inc., Smart Vision Lights, and Teledyne Dalsa Inc. Visitors with and without machine vision experience are welcome at the stand, where they can talk to company experts about specific projects as well as the fundamental advantages and possible applications of image processing in intralogistics. In addition, the EMVA trade association will be presenting its range of services and events to visitors at LogiMAT 2026. Where: Hall 2, Booth 2C14.

Expert forum in the LogiMAT Arena

On the first day of the trade fair, the expert forum in the LogiMAT Arena (Atrium East Entrance) will host a discussion organized by EMVA entitled On the Way to the Dark Warehouse – Creating Value with Machine Vision in Logistics. Experts will discuss how image processing can generate more added value in logistics, what the success factors are for the application of machine vision in logistics on the path to a higher level of automation, and which technological innovations bring the greatest benefits for users. In addition, EMVA will present the most exciting opportunities at the interface between machine vision and logistics. The panel participants will demonstrate innovative solutions with high user benefits that improve automation in logistics and optimize logistics processes with the help of AI and machine vision. When: Tuesday, March 24, from 2:10 p.m. to 3:00 p.m.

Emphasizing the sensorial basis of machine vision, the focus topic of this year’s 8th European Machine Vision Forum on October 16-17 in Fürth at the Development Center X-ray Technology of the Fraunhofer Institute for Integrated Circuits IIS was “Imaging the Invisible”. The key here is to find an “information channel” that is able to transport the image information relevant to the task at hand. In contrast to “checking by looking,” as humans do, machine vision exceeds human capabilities in some respects. This applies to the usable wavelength range of the spectrum (from Radar to Terahertz, IR, the visible range, UV, and X-rays), but also to other modalities such as acoustic data and methods for evaluating image data that are not accessible to humans like approaches based on machine learning. All of this year’s forum contributions related to this focus topic and highlighted its various aspects.

Focal topic: Imaging the invisible
The hosting Development Center X-ray Technology set a topical focus on sensor technologies based on X-rays. In several presentations and during an extensive tour of the laboratories, various technologies for using X-rays for imaging in industrial visual inspection were presented. In addition to simple images that provide a projection as a special view into the material, X-ray videos and CT reconstructions of the internal structure of technical objects as 3D models were particularly impressive. These sensory insights were supplemented by contributions on imaging using radar and terahertz radiation. A second focus in the field of imaging using electromagnetic waves was the use of a large number of channels using multi- and hyperspectral sensor technology. These sensory impulses were supplemented by approaches such as the use of single photons (using SPADs), quantum dots for image capture in the short-wave IR range, and acoustic sensor technology. The presentations on sensory solutions were supplemented by two approaches to evaluate camera performance, e.g. by extending the EMVA1288 standard. Several contributions presented possible areas of application in industrial quality assurance, particularly for detecting defects inside materials and material classification, and in medical diagnostics, for example in dermatology.

Main topics of the keynotes
The three keynote speeches highlighted different aspects of the focus topic “Imaging the invisible.” The presentation by Michael Salamon from the host Development Center X-ray Technology of the Fraunhofer Institute for Integrated Circuits IIS addressed the basics and the use of X-rays for imaging in various applications. Using the example of e-mobility, he showed how X-rays can be used to achieve the vision of flawless production by checking assembled components for completeness and defects with high resolution and accuracy, even without visual access. The sensor systems required for this were systematically developed at Fraunhofer IIS and transferred into applications. Other applications, such as the characterization of plant growth in the soil, can also be solved without intervention and thus without disruption. Jeroen Kalkman from Delft University devoted his keynote to optical coherence tomography. This technology can be used to examine the spatial and optical properties of object surfaces and partially transparent layers. Using the example of the art-historical examination of a painting, he demonstrated how repairs and restorations can be analyzed and documented in the image data. Insights into OCT research show that this technology still has considerable potential for the spatial examination of partially transparent objects. Finally, Boris Landgraf from Cosine gave a keynote presentation on the use of satellite-based multispectral sensor technology for Earth observation and astronomy applications. Particularly impressive were the requirements for reliable operation of this sensor technology in space and the sensor systems implemented on various missions.

Visit to the host institute and accompanying exhibition
A particular highlight of the two-day forum was the detailed tour of the hosting Development Center X-ray Technology. The various applications of X-ray-based imaging were presented at several stations, including the creation of complete 3D models of large objects such as entire cars and the examination of plant growth in an automated laboratory. In addition to the presentations, more than 20 posters and company presentations showcased research results, activities, and products related to the focus topic “Imaging the Invisible.” In an evening session, working groups from the host institute and companies from the surrounding area presented their main areas of focus.

Positive feedback from participants
The focal topic of high significance to the industry discussed in-depth by leading research experts and a host institute specialized in this very technology; combined with the unique networking opportunities between company representatives and the research sector made the European Machine Vision Forum 2025 again to an event which was praised by the attendees for its professional approach and high relevance.

Focal topic „Imaging the Invisible“ with the latest findings from sensor technology beyond human perception

Barcelona; September 11th, 2025. At the European Machine Vision Forum 2025 organized by EMVA, which will take place this year on October 16th and 17th in Fürth, Germany, machine vision experts from science and industry will once again meet in a unique setting to exchange ideas. The event will be hosted by the Fraunhofer Development Center for X-ray Technology at Fraunhofer IIS.

Regarding the forum’s focal topic, “Imaging the Invisible,” the forum chair Professor Michael Heizmann explains: “Our headline in 2025 addresses new capabilities and research findings in the field of sensor technology. A lot has happened in this area in recent years. We can see this, for example, at the host Development Center for X-ray Technology at Fraunhofer IIS, where another high-energy hall for X-ray inspection of very large objects is nearing completion. The fact that we will be able to experience these latest facilities live on site will certainly make the European Machine Vision Forum 2025 an unforgettable experience for participants.” In addition, other sensor principles presented in this year’s program also open up possibilities for obtaining more information than is visible to the human eye. These include terahertz, multi- and hyperspectral data, radar, thermography, and single photon imaging. In most cases, the aim is to learn something about the material or internal structure of objects that humans cannot perceive.

The host institute will deliver the opening keynote “X-ray Technology – Key for Overcoming Technological and Economic Challenges,” given by Michael Salamon, group manager for high-energy X-ray systems at the Fraunhofer IIS Development Center for X-ray Technology. Jeroen Kalkman, Associate Professor at TU Delft, will focus on 3D imaging in his keynote speech on the afternoon of the first conference day with his presentation “Advancements in 3D Imaging Using Optical Coherence Tomography.” Marco Beijersbergen, CEO of Cosine, a company specializing in optical space instruments, will address the topic of multispectral imaging in his keynote speech “Multispectral Sensors for Space Applications” on the morning of the second day. The other presentations will showcase a wide variety of sensor principles in their latest state of development.

The program is complemented by poster presentations, an exhibition area, and ample space for networking among participants. “Meaningful collaborations usually arise at the interfaces between technologies and applications,” emphasizes forum chair Prof. Heizmann in this context. “It is therefore extremely important that user companies are informed about new technologies and, on the other hand, that research institutions learn about the specific problems faced by users. This exchange is the main purpose of the forum.”

The host institute is eagerly anticipating the event, as Dr. Norman Uhlmann, Division Director the Development Center for X-ray Technology of the Fraunhofer IIS, Fürth, confirms: “We are thrilled to host the 2025 European Machine Vision Forum and will contribute to the event by presenting some of the latest developments of its x-ray technologies, such as the XXL computer tomography where high x-ray energies enable the full 3d examination of very large objects such as, for example, assembled vehicles.”

More information about the 8th European Machine Vision Forum and registration at www.european-forum-emva.org.

• Keynotes address geopolitical and socio-economic topics
• Italian vision industry highlighted in two talks
• Record number of pre-booked of B2B-meetings

Barcelona,​ May 20^th, 2025. Just about two weeks after the world has watched the Conclave in the Vatican, the 23^rd EMVA Business Conference takes place from 22 – 24 May in the eternal city of Rome. Around 110 vision-tech CEOs and other decision makers from machine vision enterprises and institutes out of 14 nations from Europe and overseas meet in Italy’s capital.

The opening keynote traditionally addressing macro-economic topics this year is given by Marcelo Carvalho with his talk “European Business Outlook – Navigating through the New Reality”. In addition, the vivid machine vision eco system in the host country Italy will be introduced by iMAGE S-CEO and EMVA Board member Marco Diani. Furthermore, pasta, the Italian national dish, is represented in the program by no one less than the Technical Development Manager Automation at Barilla who titled his talk “Understanding Vision Tech in the Food Industry”.

Many different aspects of core machine vision technology will be addressed by the other speakers in the technical part of the conference program. This includes Industrial Computed Tomography; FT spectral imaging; Railway Specific Challenges and Requirements for Fully Automated Train Operations; Imaging Trends in Defense & Security; and a talk about the future of vision sensing technology revolutionizing the way we perceive and process visual data.

The panel discussion at the beginning of the second conference day gets back on the economy and is titled “De-globalization – Managing the Change”. “Acquisitions and Inorganic Growth Considerations” is the title of another talk, a strategic topic which has been shaping the industry in the last two decades. The closing keynote by resilience coach Charlie Cannon, on the other hand this time is laid out as interactive session as it addresses Resilient Performance for Changing Times.

Besides of attractive and informative talks the EMVA Business Conference is recognized as a quite special event in the machine vision calendar because of the extraordinary networking opportunities offered. In this respect, one record has already been broken: More than 170 face-to-face meetings amongst attendees have been pre-booked in the forerunning of the conference, more than ever before during an EMVA Business Conference. On top, the evening socializing events on Thursday and Friday offer plenty of additional opportunities to connect with other participants in a pleasant atmosphere.

More information on the conference website www.business-conference-emva.org.

Eight co-exhibiting EMVA members present machine vision technology for logistics applications.

Barcelona, February 28^nd, 2025. For the second time, EMVA will be represented at LogiMAT with a joint stand. From March 11 – 13, eight EMVA member companies will be presenting their latest image processing solutions for the logistics industry at the Stuttgart trade fair in Hall 2, Stand 2C18:

MBJ Imaging will be showcasing their Patternlight product, among others. It projects patterns onto surfaces and enables 3D measurements to be carried out using stereovision. The company will also be presenting Cooled Power Spotlight, a high-performance light optimized for continuous operation with active air cooling and an integrated controller for easy commissioning.

phil-vision presents FeaturePrint® at the common EMVA booth, a revolutionary method of identification without printed features. Instead of conventional IDs, the features of the product or packaging are used as a unique identification feature. The innovative object recognition is based on perfect image capture combined with artificial intelligence.

Advantech’s AI Edge Solutions bring intelligence to logistics operations. Powered by NVIDIA® Jetson™, the MIC Jetson series delivers GPU workstation-level performance, ideal for automated sorting, package inspection, route optimization, and warehouse automation. For Autonomous Mobile Robots, the MIC-732-AO AI Inference System provides the edge AI capabilities needed for precise navigation, object detection, and real-time decision-making in warehouse and logistics environments.

Effilux will showcase on the common EMVA member booth a logistic automation system to read barcodes on any kind of pallets at high speed. More generally, Effilux’s logistic product portfolio can cover a wide range of use-cases in warehouses as size, IP rating, and software are all adjustable to match your needs.

Murrelektronik showcases at LogiMAT 2025 its modular, manufacturer-independent, fully pluggable machine vision installation solutions that bring signals, data and power into the immediate machine environment.

The Lightgistics Series from Smart Vision Lights is the first range of machine vision lights built for the logistics industry. With cutting-edge Dual OverDrive™ technology Lightgistics lights ensure unmatched brightness enabling precise barcode reading, OCR, and OCV on any package, regardless of material or speed.

OPT presents its latest smart code readers for fast, accurate, and reliable decoding in logistics, warehousing. With AI-powered deep learning algorithms, they efficiently read damaged, low-contrast, or curved barcodes, including high-density DPM codes.

Last but not least, Roboception as a provider of intelligent robot vision platforms and systems at LogiMAT 2025 will present their brand-new software module ItemPickAI – a smart solution for flexible pick-and-place robotic applications. It combines high-performance AI models with classical to pick and precisely place unknown, flexible objects such as bags.