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ACTIVE SILICON
Harrier SDI Adapter extends capability for challenging vision applications
 Active Silicon is pleased to announce the launch of its newest addition to the Harrier range – the Harrier SDI Adapter.
This is a single channel host-end acquisition solution for 3G and HD-SDI video streams. The interface is designed to work with a variety of cameras to capture high-definition images and transfer these at extremely high speed in challenging environments.
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EURESYS
CustomLogic
 Euresys present its new custom on-board FPGA processing for Coaxlink frame grabbers. CustomLogic is an FPGA design kit enabling the design and upload of FPGA code to a Coaxlink board. It is compatible with the Coaxlink Octo and Coaxlink Quad CXP-12. Up to 70% of their Xilinx Kintex Ultrascale XCKU035 FPGA resources are available. The design phase uses the Xilinx Vivado development tools. CustomLogic is the ideal solution for full custom even proprietary code. Read more ›
EURESYS
CoaXPress 2.0, Extended bandwidth and more…
 The success of CoaXPress as a high-end machine vision standard has been driven by its reliability, simplicity in terms of cable and connectors, extended cable lengths, and other industry-required features such as very low jitter triggers, camera control, and power over cable.
The CoaXPress Standard Version 2.0 brings a rich new set of features while remaining backwards compatible to CoaXPress 1.1.1. This is an overview of these new features along with example use cases.
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LUCID VISION LABS expands 5GBASE-T Atlas™ Camera Series with 5.0 and 8.9 Megapixel CMOS Models
 LUCID Vision Labs announced the serial production of two new Atlas models featuring the 5.0 MP and 8.9 MP Sony Pregius global shutter CMOS image sensors.
The award-winning Atlas camera is designed for applications requiring high bandwidth and high resolution in a compact size. The new Atlas models feature the color and monochrome version of the 5.0 MP Sony IMX250 2/3” global shutter CMOS sensor with a resolution of 2448 x 2048 px running at 98 fps, and the 8.9 MP Sony IMX255 1.1” CMOS with a resolution of 4096 x 2160 px running at 58 fps. Read more ›
SCHNEIDER KREUZNACH
The new Xenon-Opal 2.8/12 lens
 Modern applications require the highest image quality over the entire field. The new Xenon-Opal 2.8/12 compact C-mount lens from Schneider-Kreuznach fulfills these demands, designed to operate with 12 MP cameras and 1.1″ sensors.
The maximum chief ray angle of 6° assures that this lens is a perfect match for state-of-the-art sensors with pixels down to 3 μm. The robust mechanics enable the lens to be mounted on an arm of a robot system while at the same time a precise centering and field curvature correction ensures a sharp image from edge-to-edge serving high-end 3D measurement systems.
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SMART VISION LIGHTS
New High-Speed XR256-FIBER Light as a Versatile LED-Powered Alternative for Xenon Lamps
 Smart Vision Lights launched its new compact and mountable high-speed XR256-FIBER Light at the Automate 2019 conference and exhibition.
Designed to match the intensity of a Xenon source, the XR256 Fiber Light is a more versatile LED-powered alternative with T-slot mounting features. Its high-power LEDs boast a life span of more than 100,000 hours versus the 2,000 hours typical of Xenon bulbs.
XR256-FIBER Xenon Replacement Strobe LightThe XR256-FIBER Light leverages SVL’s OverDrive™ driver, allowing the light to operate strobe mode. Read more ›
SVS-VISTEK
High Speed with CoaXPress and High Resolution: the hr342
 The hr342 with CoaXPress interface is SVS-Vistek’s latest industrial camera. Its features predestine it for a multitude of demanding applications in automated quality control. SVS-Vistek’s cutting-edge technology allows maximum speed together with best image quality.
With a frame rate of 35.4 fps, the hr342 from SVS-Vistek is currently the fastest camera with the high-quality Sony IMX342 on the market. This is made possible by the new Sony SLS-EC protocol of the sensor and the CoaXPress interface.
A clever implementation of the interface and a housing design with excellent heat dissipation ensure a low operating temperature which in turn is responsible for low noise.
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Teledyne DALSA
New Genie Nano-CXP Cameras offer Unprecedented Speed and High Resolution
 Teledyne DALSA announced its new Genie Nano-CXP series, a CoaXPress line of CMOS area scan cameras that redefine performance and feature the latest On-Semiconductor and E2V sensors.
These newest industry leading image CMOS sensors range from 16 to 67 megapixel resolution with added and proven CoaXPress 6.25 Gbps technology offering breakthrough speed, robust build quality for wide operating temperature, and an unmatched feature set at an incredible price. Perfectly complemented by the half-length Xtium-CXP frame grabber, they have been designed to work synergistically, minimizing CPU usage and improving processing times for host applications by enabling maximum sustained throughput and ready-to-use image data. Read more ›
Teledyne E2V
Emerald 67M, Ultra-high Resolution Image Sensor Now Available
 Teledyne e2v announced that Teledyne e2v’s Emerald™ 67M image sensor, designed for ultra-high resolution electronics inspection, high-end surveillance and microscopy is now available.
The sensor is a member of Teledyne e2v’s Emerald family and features TowerJazz’s smallest in the world 2.5µm low-noise global shutter pixel, on TowerJazz’s 65nm platform, in its Uozu, 300mm Japanese manufacturing facility. The pixel is integrated with a unique light pipe technology, offering superb angular response, more than 80dB shutter efficiency, in a significantly small size, and extremely low noise (one electron). Read more ›
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The EMVA proudly announces that David Austin, Senior Principal Engineer at Intel Corp., will give the opening keynote at the upcoming edition of Embedded VISION Europe.
Kappa optronics receives the award as recognition for its innovation activities on the A330 MRTT Boom Enhanced Vision System.
– 96% of the participants were satisfied or very satisfied with this technology platform for vision developers. Throughout the two-day event, Sony Japan, Intel, ON Semiconductor, and other FRAMOS partners were on-hand. They presented the latest technologies in the fields of image sensors and embedded vision, 3D imaging, artificial intelligence, and image processing in Munich, Germany May 22-23, 2019.
