June 2019


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JUNE 2019

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Dear ,

Welcome to the EMVA newsletter! Each month it provides hands-on information on machine vision in Europe and the world. Find out about the latest projects of the EMVA, innovative products, what’s going on in the machine vision industry and interesting events.

Thomas Lübkemeier
Kind regards,
Thomas Lübkemeier
EMVA General Secretary


Embedded VISION Europe 2019
David Austin from INTEL to give Keynote:
Flexible and Practical AI for Industrial Deployment

The EMVA proudly announces that David Austin, Senior Principal Engineer at Intel Corp., will give the opening keynote at the upcoming edition of Embedded VISION Europe.

David is working on AI based solutions for the industrial IoT market. His work focuses on deep learning architecture design, traditional computer vision. He has spent 19 years working in manufacturing related data science roles at Intel.

David was the 1st place winner in the 2nd Annual YouTube-8M Video Understanding Challenge, and is currently ranked #11 in the world competition rankings out of 112k competitors on the Kaggle data science platform.

Embedded VISION Europe 2019 targets developers and users of embedded (vision) systems from all industries. The conference will be supplemented by an exhibition where all participating companies are invited to show their embedded vision expertise through products and applications.

For the time being there are still opportunities left to play an active role as speaker and/or exhibitor at Embedded VISION Europe. Details at www.embedded-vision-emva.org

Don’t miss to benefit from the reduced ‘Early Bird’
registration fees and register immediately.


European Machine Vision Forum
Progamme of European Forum is published

The 4th edition of EMVA’s European Machine Vision Forum is taking place 5-6 September in the Palais de la Bourse, Lyon, France. The forum offers the perfect platform where Research meets Industry and the focal topic this time is ‘Photonics and Machine Vision: Going Deep into Integration.

The forum progamme offering top-noche presentations is to be found at the event webpage www.european-forum-emva.org

Companies like Advantech, Allied Vision, Euresys, Sony, Stemmer Imaging, SVS Vistek among others will showcase their products and expertise in the forum supplementing table-top exhibition.




Member News

Airbus awards ‘Best Innovator Overall’ for Defence and Space business

Image Kappa optronics receives the award as recognition for its innovation activities on the A330 MRTT Boom Enhanced Vision System.

Airbus revealed the winners of its best in class Defence and Space awards with an official ceremony at its 5thSupplier Conference on May 16, 2019. The four winners, among them Kappa optronics, were selected from the entire supply chain of more than 10,000 suppliers.
Read more ›



The “FRAMOS Tech Days” provided detailed insights into Vision Technologies, Manufacturer Roadmaps, and Processing Trends

The fourth FRAMOS® Tech Days event was a complete success – 96% of the participants were satisfied or very satisfied with this technology platform for vision developers. Throughout the two-day event, Sony Japan, Intel, ON Semiconductor, and other FRAMOS partners were on-hand. They presented the latest technologies in the fields of image sensors and embedded vision, 3D imaging, artificial intelligence, and image processing in Munich, Germany May 22-23, 2019.
Read more ›

Case Study

The next step in carbon-neutral energy production


The Dutch Institute for Fundamental Energy Research (DIFFER) is currently developing a carbon neutral energy production through the means of nuclear fusion.
This complex process requires a failsafe control system to oversee that the whole procedure is secure and smooth.
The multi-spectral imaging system called MANTIS is part of the structure and it utilizes the XIMEA multi-camera setup to help maintain a stable state.
The PCIe technology on which the solution is based enables data retrieval at virtually zero latency ensuring real time capabilities of the system. Read more ›

Recent case studies

Read more ›




Harrier SDI Adapter extends capability for challenging vision applications

Image Active Silicon is pleased to announce the launch of its newest addition to the Harrier range – the Harrier SDI Adapter.
This is a single channel host-end acquisition solution for 3G and HD-SDI video streams. The interface is designed to work with a variety of cameras to capture high-definition images and transfer these at extremely high speed in challenging environments.
Read more ›


Image Euresys present its new custom on-board FPGA processing for Coaxlink frame grabbers. CustomLogic is an FPGA design kit enabling the design and upload of FPGA code to a Coaxlink board. It is compatible with the Coaxlink Octo and Coaxlink Quad CXP-12. Up to 70% of their Xilinx Kintex Ultrascale XCKU035 FPGA resources are available. The design phase uses the Xilinx Vivado development tools. CustomLogic is the ideal solution for full custom even proprietary code. Read more ›

CoaXPress 2.0, Extended bandwidth and more…

Image The success of CoaXPress as a high-end machine vision standard has been driven by its reliability, simplicity in terms of cable and connectors, extended cable lengths, and other industry-required features such as very low jitter triggers, camera control, and power over cable.
The CoaXPress Standard Version 2.0 brings a rich new set of features while remaining backwards compatible to CoaXPress 1.1.1. This is an overview of these new features along with example use cases.
Read more ›

LUCID VISION LABS expands 5GBASE-T Atlas™ Camera Series with 5.0 and 8.9 Megapixel CMOS Models

Image LUCID Vision Labs announced the serial production of two new Atlas models featuring the 5.0 MP and 8.9 MP Sony Pregius global shutter CMOS image sensors.
The award-winning Atlas camera is designed for applications requiring high bandwidth and high resolution in a compact size. The new Atlas models feature the color and monochrome version of the 5.0 MP Sony IMX250 2/3” global shutter CMOS sensor with a resolution of 2448 x 2048 px running at 98 fps, and the 8.9 MP Sony IMX255 1.1” CMOS with a resolution of 4096 x 2160 px running at 58 fps. Read more ›

The new Xenon-Opal 2.8/12 lens

ImageModern applications require the highest image quality over the entire field. The new Xenon-Opal 2.8/12 compact C-mount lens from Schneider-Kreuznach fulfills these demands, designed to operate with 12 MP cameras and 1.1″ sensors.

The maximum chief ray angle of 6° assures that this lens is a perfect match for state-of-the-art sensors with pixels down to 3 μm. The robust mechanics enable the lens to be mounted on an arm of a robot system while at the same time a precise centering and field curvature correction ensures a sharp image from edge-to-edge serving high-end 3D measurement systems.
Read more ›

New High-Speed XR256-FIBER Light as a Versatile LED-Powered Alternative for Xenon Lamps

Image Smart Vision Lights launched its new compact and mountable high-speed XR256-FIBER Light at the Automate 2019 conference and exhibition.
Designed to match the intensity of a Xenon source, the XR256 Fiber Light is a more versatile LED-powered alternative with T-slot mounting features. Its high-power LEDs boast a life span of more than 100,000 hours versus the 2,000 hours typical of Xenon bulbs.
XR256-FIBER Xenon Replacement Strobe LightThe XR256-FIBER Light leverages SVL’s OverDrive™ driver, allowing the light to operate strobe mode. Read more ›

High Speed with CoaXPress and High Resolution: the hr342

Image The hr342 with CoaXPress interface is SVS-Vistek’s latest industrial camera. Its features predestine it for a multitude of demanding applications in automated quality control. SVS-Vistek’s cutting-edge technology allows maximum speed together with best image quality.
With a frame rate of 35.4 fps, the hr342 from SVS-Vistek is currently the fastest camera with the high-quality Sony IMX342 on the market. This is made possible by the new Sony SLS-EC protocol of the sensor and the CoaXPress interface.
A clever implementation of the interface and a housing design with excellent heat dissipation ensure a low operating temperature which in turn is responsible for low noise.
Read more ›

Teledyne DALSA
New Genie Nano-CXP Cameras offer Unprecedented Speed and High Resolution

Image Teledyne DALSA announced its new Genie Nano-CXP series, a CoaXPress line of CMOS area scan cameras that redefine performance and feature the latest On-Semiconductor and E2V sensors.
These newest industry leading image CMOS sensors range from 16 to 67 megapixel resolution with added and proven CoaXPress 6.25 Gbps technology offering breakthrough speed, robust build quality for wide operating temperature, and an unmatched feature set at an incredible price. Perfectly complemented by the half-length Xtium-CXP frame grabber, they have been designed to work synergistically, minimizing CPU usage and improving processing times for host applications by enabling maximum sustained throughput and ready-to-use image data. Read more ›

Teledyne E2V
Emerald 67M, Ultra-high Resolution Image Sensor Now Available

Image Teledyne e2v announced that Teledyne e2v’s Emerald™ 67M image sensor, designed for ultra-high resolution electronics inspection, high-end surveillance and microscopy is now available.
The sensor is a member of Teledyne e2v’s Emerald family and features TowerJazz’s smallest in the world 2.5µm low-noise global shutter pixel, on TowerJazz’s 65nm platform, in its Uozu, 300mm Japanese manufacturing facility. The pixel is integrated with a unique light pipe technology, offering superb angular response, more than 80dB shutter efficiency, in a significantly small size, and extremely low noise (one electron). Read more ›

Job offers

EMVAMarketing Assistant (m/f/o) ›

Active Silicon

FPGA Design Engineer (m/f/o) ›

Software Engineer (m/f/o) ›


Senior Research Engineer for Machine Vision (m/f/o)

Scientist for Machine Vision (m/f/o)

Junior Scientist for Machine Vision (m/f/o)

Master Thesis “Improved surface reconstruction for industrial quality inspection” (m/f/o)


FPGA Gigabit Design Engineer (m/f/o)


Business Development- and Portfolio Manager (m/f/o) ›

Manager Marketing Communications (m/f/o) ›

Field Application Engineer (m/f/o) ›

Production Manager in Electronics (m/f/o) ›


Ingenieur für Bildsensor- und Kameratechnik (m/f/o) ›

Softwareentwickler Kamerasysteme (m/f/o) ›

Produktmanager Kamera (m/f/o) ›

Applikationsspezialist Bildverarbeitung Second Level (m/f/o) ›


Verification & Validation Engineer (m/f/o) ›

Head of Software Design / Fachgruppenleiter Software Design (m/f/o) ›

FPGA Entwicklungsingenieur (m/f/o) ›

Hardware Entwicklungsingenieur (m/f/o) ›

Junior Vertriebsingenieur international (m/f/o) ›

Projektmanager (m/f/o) ›


Project Manager R&D Projects (m/f/o)

Support Engineer (m/f/o)


Upcoming Highlights


European Machine Vision Forum

5 – 6 September 2019
Lyon, France
Visit Webseite ›


Measurement World

24 – 26 September 2019
Paris, France
Visit Webseite ›


Embedded VISION Europe

24 – 25 October 2019
Stuttgart, Germany
Visit Webseite ›

Read more events ›

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