In the backend process of semiconductor manufacturing, die bonders and wire bonders are essential for chip packaging. As chips become increasingly miniaturized and packaging efficiency improves, industrial cameras must meet higher standards—not just functional adequacy, but extreme performance compatibility. Key metrics now include ultra-compact size, lightweight design, and high-speed responsiveness. Traditional industrial cameras, hindered by bulky dimensions, excessive weight, and limited dynamic performance, struggle to integrate with fast-moving robotic arms or confined spaces, significantly limiting packaging precision and throughput.
