October 2025

More than 70 attendees enjoyed two days of extensive exchange about technologies and applications headlined ‘Imaging The Invisible‘.
One highlight was the guided laboratory tour at the forum hosting Development Center X-ray Technology of the Fraunhofer Institute for Integrated Circuits IIS.

Imaging the invisible – the key here is to find an “information channel” that is able to transport the image information relevant to the task at hand. In contrast to “checking by looking,” as humans do, machine vision exceeds human capabilities in some respects.
This applies to the usable wavelength range of the spectrum (from Radar to Terahertz, IR, the visible range, UV, and X-rays), but also to other modalities such as acoustic data and methods for evaluating image data that are not accessible to humans like approaches based on machine learning. All of this year’s forum contributions were related to this focus topic and highlighted its various aspects. Read more ›

In the backend process of semiconductor manufacturing, die bonders and wire bonders are essential for chip packaging. As chips become increasingly miniaturized and packaging efficiency improves, industrial cameras must meet higher standards—not just functional adequacy, but extreme performance compatibility. Key metrics now include ultra-compact size, lightweight design, and high-speed responsiveness. Traditional industrial cameras, hindered by bulky dimensions, excessive weight, and limited dynamic performance, struggle to integrate with fast-moving robotic arms or confined spaces, significantly limiting packaging precision and throughput. Read more ›

Edmund Optics® has expanded its optomechanics offering with the launch of Ultraprecision Kinematic Mounts, enabling customers to source both precision optics and precision mounts from a single, reliable partner.

The new mounts are engineered to align precisely with Edmund Optics’ existing optomechanics and components, ensuring immediate cross-family compatibility and effortless system integration. This allows engineers and research teams to build complete optical assemblies faster—without the alignment challenges that come from mixing suppliers.

SICK Nova 2.14 comes with lots of new features and improvements that truly make machine vision easy to use.

With added support for SICK Ranger3, now also our most flexible high-end 3D camera can benefit of all advantages that SICK Nova brings. You have questions? With the new Documentation tab, help and documentation with how-to-do guides, images and video snippets* are embedded directly in the user-interface. And that’s not the only thing that has become smarter; discover the clever annotation assistant and parameter tuning function in the AI Object Detection tool. Read more ›

Vision Components is expanding its product range with the VC MIPI® Multiview Cam, a camera array with nine image sensors. Based on this module, individual vision sensors for light field measurements, multiview and multispectral imaging can be developed quickly and easily. Connection to a processor board is via a single MIPI CSI-2 interface. The VC MIPI® Multiview Cam will be unveiled at embedded world North America, which will take place from November 4-6, 2025, in Anaheim, California. Read more ›

With the latest machine vision release, wenglor sensoric group is introducing the AI Lab: a browser-based platform for training AI models for industrial image processing. The AI Lab enables efficient data management and AI model training in the cloud, while the uniVision 3 software enables image recording and the high-performance execution of AI models on machine vision products. The weHub software ensures seamless communication between the AI Lab cloud platform and the uniVision 3 image processing software. In the “AI Loop” workflow, weHub handles the upload of image data and the download of AI models. The AI Loop provides users with an intuitive workflow for easy and fast AI modeling. Read more ›