March 2025 – EMVA

Modern image sensors cover a much wider range of electromagnetic waves than the human eye – from gamma rays to terahertz waves. They can be significantly faster than the eye, capture the polarization state, cover many spectral channels, make material properties and surface shapes visible through the targeted use of lighting and capture not only electromagnetic radiation but also particle radiation and acoustic waves. The European Machine Vision Forum is therefore focusing on “Imaging the Invisible”. This includes image sensor technology, lighting, system optimization and evaluation methods.

You are invited to share your expertise and valuable contribution to this focal topic in person. In addition, we invite contributions on current research and development results in the field of machine vision. Read more ›

Fabrizio Preda, CEO of NIREOS, will introduce HERA, an innovative hyperspectral imaging system developed by NIREOS SRL. Utilizing a patented Fourier-transform technology, HERA captures hyperspectral images across an unprecedently wide spectral range, spanning from the visible to the short-wave infrared. This groundbreaking capability unlocks new applications in both scientific and industrial fields, including material characterization, life sciences, material science, and industrial quality control.

Fabrizio Preda holds a Master’s degree in Physics Engineering from Politecnico di Milano, where he worked as a research fellow for five years after graduating in 2015. He has authored multiple peer-reviewed articles and is a co-inventor of three international patents.
In 2018, Fabrizio co-founded NIREOS, an official spin-off of Politecnico di Milano, and currently acts as its Chief Executive Officer. Under his leadership, NIREOS has grown into a dynamic Italian company developing innovative devices for spectroscopy and photonics for both scientific and industrial applications.

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On April 2nd it’s that time again: inVISION Day Metrology 2025 – the digital conference for Metrology and NDT – opens its virtual doors!

Experience twelve exciting presentations from leading companies such as Mahr, Zeiss and Photoneo…, which present the latest trends in 3D scanners, inline metrology, surface metrology and CT/X-Ray.
A highlight of the event is the keynote “Unconventional Optical Metrology – New Possibilities Beyond Classical Systems“, presented by Fraunhofer IPM. And that’s not all! At the end of the conference, the panel discussion “Virtual Clamping – The End of Physical Measurement Fixtures?” awaits you. Take the opportunity to ask your questions and discuss with experts.

In addition, as part of EMVA Innovations, the EMVA is introducing four companies that will present their latest technologies in short, inspiring presentations. Read more ›

MBJ Imaging was born from the conviction of two engineers that it must be possible to manufacture lighting for machine vision so inexpensive and at the same time of such high quality that it is not necessary for anyone to develop their own lighting. This idea still guides us in what we do.
The team behind MBJ consists of experts with many years of experience in the industry and high technological competence. But even more important is the passion and absolute customer focus: we burn for the best solution for our customers. Read more ›

Edmund Optics is proud to announce that its Akita, Japan and Mainz, Germany manufacturing sites now operate on 100% renewable energy. This transition significantly advances EO’s commitment to reducing global emissions and fostering sustainable operations. The Akita site specializes in manufacturing and coating precision optics, focusing on spherical lenses and optical filters, while the Mainz site focuses on manufacturing polarizers and processing Schott color glass, with both playing a crucial role in Edmund Optics’ manufacturing structure. Read more ›

Wire bonding is a key process in semiconductor production.
Extremely fine wires with diameters of 15 to 75 micrometres are used to create tiny electrical connections between a semiconductor chip and other components. The distances between the bond wires are often less than 100 micrometres. Any deviation, however small, can lead to connection errors. Wire bonding therefore requires the highest precision and forms the basis for the production of high-performance electronics, which are used in many different applications.
F&S BONDTEC Semiconductor GmbH from Braunau, Austria, relies on image processing technology with industrial cameras from IDS Imaging Development Systems GmbH for the precise determination of wire positions and for quality assurance. Read more ›

Teledyne DALSA announces the new Tetra™ line scan camera family. Designed for a wide range of machine vision applications, Tetra leverages Teledyne’s latest multiline CMOS image sensor technology and builds on the success of the original Linea™ series of high-value line scan cameras.
The Tetra camera family is designed for cost-sensitive applications, offering a high performance-to-cost ratio through its 2.5 GigE Vision interface, which ensures highly reliability data transmission over long cable lengths. Read more ›

LUCID Vision Labs, Inc., is pleased to announce that the new Helios™2 Narrow 3D Time-of-Flight (ToF) camera has entered series production and is now shipping.
Helios2 Narrow 3D CameraEquipped with Sony’s IMX556 DepthSense sensor, the Helios2 Narrow features a more focused illumination to generate real-time 3D point cloud data with exceptional accuracy and reduced multipath interference. Its narrow 31° x 24° field of view (FoV) enables high-precision depth measurements, making it ideal for applications that require enhanced accuracy within a defined working range. Read more ›

Machine vision is playing an increasingly important role in more and more intralogistics applications. The more of these systems are used and the more different manufacturers are involved, the more urgent the need for an efficient, modular and manufacturer-independent installation concept becomes.
Murrelektronik has developed a convincing all-in-one solution that offers many advantages. Just in time for LogiMAT, the company presents a new installation bundle specifically for single camera applications: One-Cam-Connect. Read more ›

Nuvo-11000 series is Neousys’ flagship rugged embedded computer built on the Intel® Core™ Ultra 200 series platform. Powered by TSMC’s advanced 3nm photolithography, the latest Core™ Ultra 200 processors offer up to 24 cores/ 24 threads with higher CPU clock rates, and an integrated neural processing unit (NPU) for AI acceleration. This results in a 1.2x boost in CPU performance and AI computing capabilities of up to 36 TOPs. Combined with DDR5-6400 memory and PCIe Gen5 support, it delivers a significant improvement in computing power, enhancing performance across diverse industrial applications. Read more ›

With the unique market leading sensor technology developed by SICK, ultra fine details in RGB and grayscale can be captured in the excellent resolution of 5,120 pixels. The high-resolution 2D data is easily captured concurrently and can be aligned with the high-precision 3D data. All done using only the Ranger3.

With the new 2.5 Gbit/s network interface, more data can be streamed from the camera and 3D profile rates of up to 69 kHz can be achieved.
The high-speed interface also allows 3D data in combination with reflectance and scatter data at speeds up to 46 kHz.