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Dear
Welcome to the EMVA newsletter! Each month it provides hands-on information on machine vision in Europe and the world. Find out about the latest projects of the EMVA, innovative products, what’s going on in the machine vision industry and interesting events.
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Kind regards,
Thomas Lübkemeier
EMVA General Secretary
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LogiMAT 2025 | 11-13 March in Stuttgart
EMVA at LogiMAT- Booth and Presentations
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The EMVA will be present at the LogiMAT with a member booth and organizing a session during the LogiMAT Expert Forum.
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Visit us and our co-exhibiting members Advantech, Effilux, Murrelektronik, MBJ Imaging, OPT, Smart Vision Lights and Phil-Vision at the EMVA Member Booth in hall 2, booth 2C18.
Details on the solutions presented by our co-exhibitors may be found via the link: Read more ›
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LogiMAT Expert Forum: “AI-based image processing is changing logistics”.
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Machine vision plays a decisive role in the optimization of logistics processes. At this year’s LogiMAT, three keynote speakers will show how AI and machine vision can optimize logistics processes at the EMVA expert forum “AI-based machine vision is changing logistics”.
The 50 minute session starts Tuesday, March 11th at 3 pm. in the LogiMAT Arena, Atrium, East Entrance. Read more ›
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EMVA Business Conference 2025
The VisionTech Ecosystem in Italy
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The EMVA Conference 22-24 May in Rome again is a must-be-there event for VisionTech leaders in 2025. Starting with this newsletter edition the EMVA proudly presents conference speakers and topics.
In good tradition one talk gives a comprehensive introduction to the vision ecosystem of the conference hosting country.
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This time Marco Diani, CEO of iMAGE S and EMVA Board Member, will give insights of the Italian machine vision market. Since receiving his PhD in Machine Vision in 1989, Marco spent his entire carreer in our industry. In 1994, he was one of the founding partners of iMAGE S, a leading distributor of machine vision components in Italy and one of the original members of the EMVA.
Conference attendees surely will benefit from Marco sharing his extraordinary experience and deep knowledge about the Italian industry and automation market.
The button below brings you to the event platform providing info on agenda, speakers, optional offers, fees etc.
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International Vision Standards Meeting | Spring ’25
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Experts of vision related standards from around the world will meet April 28 – May 2 in Québec, Canada, for their 2025 spring meeting supported by the global G3 group (A3, EMVA, JIIA, VDMA and CMVU).
Vision and image processing experts from around the world will discuss the further development of various vision related standards in the different working groups. Allways being one of the highlights, the meeting will include the traditional plugfest where engineers apply the standards connecting a wide range of products to test compatibility, functionality and technical performance.
All meetings will take place at the Clarendon Hotel, which is located in the heart of Old Quebec. This charming hotel is just a few steps away from the city’s activities and attractions. This hotel offers a distinctive historic experience alongside the comfort and services of a 4-star property. Read more ›
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EMVA welcomes new member
imavix engineering s.r.o.
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The industrial machine vision experts
imavix engineering offers FPGA IP cores and related development and consultancy services implementing standard machine vision interfaces based on GenICam, image sensor and camera interfaces, and PCIe host interfaces. Our main focus is on Ethernet and especially GigE Vision based transport layers including the RDMA/RoCEv2 technology and also the PCIe host interfaces with DMA streaming engines.
The products and services of imavix engineering target the Efinix power-efficient FPGA devices. Read more ›
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EDMUND OPTICS
Marisa Edmund Appointed to Board of Trustees for OPTICA Global Photonics Economic Forum
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Edmund Optics is proud to announce that Marisa Edmund, Chairman of the Board and CEO, has been appointed to the Board of Trustees for the prestigious OPTICA Global Photonics Economic Forum, taking place October 7-8, 2025 in Malaga, Spain. In addition, Marisa will serve as a keynote speaker, joining top executives in discussing the future of the photonics industry.
As the first and only woman on the Board, Marisa joins an esteemed group of industry leaders, including Chuck Mattera (Coherent), Edwin Rocks (Teledyne), and John Lee (MKS). Her appointment highlights Edmund Optics’ growing recognition within the global optics and photonics community. Read more ›
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EDMUND OPTICS
New Distribution Hub to Enhance Customer Service in European Union
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Edmund Optics (EO), a leading supplier of optical components, assemblies and solutions, is proud to announce the opening of a new distribution center in Best, Netherlands, near Eindhoven, a prominent hotspot for innovation, design, and technology. This milestone underscores EO’s commitment to enhancing service and efficiency for customers across the European Union (EU) while supporting the company’s continued global growth. Read more ›
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TELEDYNE VISION SOLUTIONS
Advanced mobile mapping services using Teledyne IIS spherical imaging solution
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AnkaGeo uses Teledyne FLIR IIS’s Ladybug6 in its mobile mapping system to create advanced three-dimensional maps.
AnkaGeo, a Turkish based organization founded in 2009 specializes in advanced mobile mapping services. They have developed a Mobile Mapping System (MMS) that uses a combination of state-of-the-art sensors such as a powerful lidar system, a high-resolution laser scanner, GPS, an odometer, and as a core element – the Ladybug6 to generate high-resolution 360° images. The collected data from these sensors is then combined and processed using their in-house mobile mapping software to create three-dimensional maps. Read more ›
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AEON
Upcoming 3-day Online Training on EMVA 1288
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From April 1 – April 3, 2025, 09:00 a.m. – 02:00 p.m. each day, AEON offers the next online training on EMVA 1288, the worldwide accepted standard for objective characterization of machine vision cameras.
The course is held by Prof. Bernd Jähne, chair of the international EMVA 1288 working group, and supplies all the knowledge needed to be prepared for the EMVA 1288 expert certification. Read more ›
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Teledyne DALSA
Next generation AI-powered smart camera for industrial automation and inspection
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Teledyne DALSA is pleased to introduce its next generation AI-powered BOA™3 smart camera for industrial automation and inspection.
The new BOA3 smart camera is designed to leverage the best features from previous BOA generations and combine them with new sensor and AI (Artificial Intelligence) inspection technologies developed by Teledyne. BOA3 is a highly integrated vision system in a compact, rugged smart camera format designed to meet the needs of the most complex, demanding machine vision applications. Read more ›
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Teledyne E2V
New high-speed sensor with extended sensitivity in NIR wavelengths
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Teledyne e2v introduces Lince5M™ NIR, a state-of-the-art high-speed CMOS image sensor. Leveraging Teledyne e2v’s advanced imaging technologies, this new sensor delivers enhanced performance in both visible and near-infrared (NIR) wavelengths, making it ideal for a wide range of commercial, industrial, and medical applications.
The Lince5M NIR is a monochrome image sensor with a resolution of 5.2 megapixels (2,560 x 2,048). Building on the established Lince5M, this new sensor combines high-speed capabilities and high Quantum Efficiency (35% at 850 nm) in both visible and near-infrared wavelengths. Read more ›
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JAI
Expanding its prism-based R-G-B color line scan camera lineup with two new models featuring CoaXPress 2.0 CXP-12 interface
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JAI has expanded its Sweep+ Series of prism-based R-G-B line scan cameras with the introduction of two new models featuring the high-speed CoaXPress 2.0 CXP-12 interface. The new models, SW-4000T-CXPA and SW-8000T-CXPA, offer impressive color imaging capabilities with resolutions of 4096 (4K) pixels and 8192 (8K) pixels per R-G-B line, respectively.
Both models leverage the fast plug-and-play CoaXPress CXP-12 interface, supporting data output speeds of up to 12.5 Gbps via a single Micro-BNC cable. Read more ›
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LUCID VISION LABS
Launches 45-Megapixel Atlas10 Camera with onsemi’s XGS 45000 CMOS Image Sensor
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LUCID Vision Labs, Inc., has expanded its Atlas®10 series with the release of a new high-resolution model featuring onsemi’s XGS 45000 CMOS global shutter image sensor.
Atlas10 45mp onsemi XGS 45000 camera frontThe Atlas10 – 10GigE model features the 45-megapixel (8192 x 5460) onsemi XGS 45000 CMOS sensor, which delivers high-resolution imaging capable of 16 frames per second at 8-bit and 10-bit outputs. With its combination of high resolution, fast readout speed, and low power consumption, this new model provides a significant boost to industrial imaging applications. Read more ›
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ROBOCEPTION
ItemPickAI – AI-based Module enables Picking and Oriented Placing of ‘Unseen’ Objects
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With the software image 25.01.0, Roboception has also launched its latest software component: rc_reason ItemPickAI.
The rc_reason ItemPickAI software enables AI-based grasping and oriented placement of so-called ‘unseen’ objects – i.e. objects, that the system has not explicitly learned by teaching models or seen in training data in advance.
ItemPickAI enables automated separation and oriented placement even of deformable objects: Robotic pick-and-place applications such as the palletizing and unpacking of bags, sacks and various pouch packaging can be implemented precisely and efficiently. Read more ›
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SINCEVISION
Unveils the Largest FOV 3D Laser Profiler Sensor: SRI71600
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SinceVision introduces the SRI71600 3D Laser Profiler, featuring the largest field of view (FOV) in the industry. Compact and IP67-rated, it integrates a sensor head and controller for 65% space efficiency. With advanced features like 3200 X-axis contour points, multi-laser wavelengths, and high-speed scanning up to 20,000 Hz, it ensures precise, reliable performance for automotive, electronics, and logistics industries.
Read more ›
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WHEC
CIS line scan camera equipped with CoaXPress 2.0
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WHEC can provide CIS with interface of Camera Link, CoaXPress, 10 GigE, USB3.0. While CoaXPress 1.1 was the fastest among them, we introduce you our latest CIS supporting CoaXPress 2.0. This CIS series significantly improves data transfer speeds compared to the previous CoaXPress interface, achieving a maximum reading speed of 480 meters per minute (300 dpi, color). This enables support for applications that require high-resolution and high-speed inspection. Read more ›
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European Machine Vision Association , Gran Vía de Carles III 84 (planta 3ª), 08028 Barcelona, Spain
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