Wire bonding is a key process in semiconductor production.
Extremely fine wires with diameters of 15 to 75 micrometres are used to create tiny electrical connections between a semiconductor chip and other components. The distances between the bond wires are often less than 100 micrometres. Any deviation, however small, can lead to connection errors. Wire bonding therefore requires the highest precision and forms the basis for the production of high-performance electronics, which are used in many different applications.
F&S BONDTEC Semiconductor GmbH from Braunau, Austria, relies on image processing technology with industrial cameras from IDS Imaging Development Systems GmbH for the precise determination of wire positions and for quality assurance
